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caution electro-static sensitive devices the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. bipolar analog integrated circuit m m m m pc8178tb silicon mmic low current amplifier for mobile communications document no. p14895ej2v0ds00 (2nd edition) date published november 2000 n cp(k) printed in japan data sheet 2000 the mark shows major revised points. description the m pc8178tb is a silicon monolithic integrated circuit designed as amplifier for mobile communications. this ic can realize low current consumption with external chip inductor which can not be realized on internal 50 w wideband matched ic. this low current amplifier operates on 3.0 v. this ic is manufactured using necs 30 ghz f max uhs0 (ultra h igh s peed process) silicon bipolar process. this process uses direct silicon nitride passivation film and gold electrodes. these materials can protect the chip surface from pollution and prevent corrosion/migration. thus, this ic has excellent performance, uniformity and reliability. features ? low current consumption : i cc = 1.9 ma typ. @ v cc = 3.0 v ? supply voltage : v cc = 2.4 to 3.3 v ? excellent isolation : isl = 39 db typ. @ f = 1.0 ghz isl = 40 db typ. @ f = 1.9 ghz isl = 38 db typ. @ f = 2.4 ghz ? power gain : g p = 11.0 db typ. @ f = 1.0 ghz g p = 11.5 db typ. @ f = 1.9 ghz g p = 11.5 db typ. @ f = 2.4 ghz ? gain 1 db compression output power : p o (1 db) = - 4.0 dbm typ. @ f = 1.0 ghz p o (1 db) = - 7.0 dbm typ. @ f = 1.9 ghz p o (1 db) = - 7.5 dbm typ. @ f = 2.4 ghz ? operating frequency : 0.1 to 2.4 ghz (output port lc matching) ? high-density surface mounting : 6-pin super minimold package (2.0 1.25 0.9 mm) ? low weight : 7 mg (standard value) application ? buffer amplifiers on 0.1 to 2.4 ghz mobile communications system
data sheet p14895ej2v0ds00 2 m m m m pc8178tb ordering information part number package marking supplying form m pc8178tb-e3 6-pin super minimold c3b embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. qty 3 kpcs/reel. remark to order evaluation samples, please contact your local nec sales office. (part number for sample order: m pc8178tb) pin connections 3 2 1 4 c3b (top view) 5 6 4 5 6 3 (bottom view) 2 1 pin no. pin name 1 input 2gnd 3gnd 4output 5gnd 6v cc
data sheet p14895ej2v0ds00 3 m m m m pc8178tb product line-up (t a = +25c, v cc = v out = 3.0 v, z s = z l = 50 w w w w ) 1.0 ghz output port matching frequency 1.66 ghz output port matching frequency 1.9 ghz output port matching frequency 2.4 ghz output port matching frequency parameter part no. i cc (ma) g p (db) isl (db) p o(1db) (dbm) g p (db) isl (db) p o(1db) (dbm) g p (db) isl (db) p o(1db) (dbm) g p (db) isl (db) p o(1db) (dbm) marking m pc8178tb 1.9 11 39 - 4.0 --- 11.5 40 - 7.0 11.5 38 - 7.5 c3b m pc8179tb 4.0 13.5 44 +3.0 --- 15.5 42 +1.5 15.5 41 +1.0 c3c m pc8128tb 2.8 12.5 39 - 4.0 13 39 - 4.0 13 37 - 4.0 --- c2p m pc8151tb 4.2 12.5 38 +2.5 15 36 +1.5 15 34 +0.5 --- c2u m pc8152tb 5.6 23 40 - 4.5 19.5 38 - 8.5 17.5 35 - 8.5 --- c2v remark typical performance. please refer to electrical characteristics in detail. system application example location examples in digital cellular rx low noise tr. sw tx n pll pll i q i q demod. 0 90 pa f these ics can be added to your system around v parts, when you need more isolation or gain. the application herein, however, shows only examples, therefore the application can depend on your kit evaluation.
data sheet p14895ej2v0ds00 4 m m m m pc8178tb pin explanation pin no. pin name applied voltage (v) pin voltage (v) note function and applications internal equivalent circuit 1 input - 0.91 signal input pin. a internal matching circuit, configured with resisters, enables 50 w connec- tion over a wide band. this pin must be coupled to signal source with capacitor for dc cut. 2 3 5 gnd 0 - ground pin. this pin should be connected to system gr ound with minimum inductance. ground pattern on the board should be formed as wide as possible. all the ground pins must be con- nected together with wide ground pattern to decrease impedance defference. 4 output voltage as same as v cc through external inductor - signal output pin. this pin is de- signed as collector output. due to the high impedance output, this pin should be externally equipped with lc matching circuit to next stage. for l, a size 1005 chip inductor can be chosen. 6v cc 2.4 to 3.3 - power supply pin. this pin should be externally equipped with bypass capacitor to minimize its impedance. 2 3 5 6 4 1 note pin voltage is measured at v cc = 3.0 v.
data sheet p14895ej2v0ds00 5 m m m m pc8178tb absolute maximum ratings parameter symbol conditions ratings unit supply voltage v cc t a = +25c, pin 4, pin 6 3.6 v circuit current i cc t a = +25c 15 ma power dissipation p d mounted on double sided copper clad 50 50 1.6 mm epoxy glass pwb (t a = +85c) 270 mw operating ambient temperature t a - 40 to +85 c storage temperature t stg - 55 to +150 c input power p in t a = +25c +5 dbm recommended operating conditions parameter symbol min. typ. max. unit remarks supply voltage v cc 2.4 3.0 3.3 v the same voltage should be applied to pin 4 and pin 6. operating ambient temperature t a - 40 +25 +85 c electrical characteristics (unless otherwise specified, t a = +25 c, v cc = v out = 3.0 v, z s = z l = 50 w w w w , at lc matched frequency) parameter symbol conditions min. typ. max. unit circuit current i cc no signal 1.4 1.9 2.4 ma power gain g p f = 1.0 ghz, p in = - 30 dbm f = 1.9 ghz, p in = - 30 dbm f = 2.4 ghz, p in = - 30 dbm 9.0 9.0 9.0 11.0 11.5 11.5 13.0 13.5 13.5 db isolation isl f = 1.0 ghz, p in = - 30 dbm f = 1.9 ghz, p in = - 30 dbm f = 2.4 ghz, p in = - 30 dbm 34 35 33 39 40 38 - - - db gain 1 db compression output power p o(1db) f = 1.0 ghz f = 1.9 ghz f = 2.4 ghz - 8.0 - 11.0 - 11.5 - 4.0 - 7.0 - 7.5 - - - dbm noise figure nf f = 1.0 ghz f = 1.9 ghz f = 2.4 ghz - - - 5.5 5.5 5.5 7.0 7.0 7.0 db input return loss rl in f = 1.0 ghz, p in = - 30 dbm f = 1.9 ghz, p in = - 30 dbm f = 2.4 ghz, p in = - 30 dbm 4 5 6.5 7 8 9.5 - - - db
data sheet p14895ej2v0ds00 6 m m m m pc8178tb test circuits <1> f = 1.0 ghz in out 50 w l 1 4 2, 3, 5 6 1 50 w c 1 c 2 c 3 v cc c 4 c 5 output port matching circuit <2> f = 1.9 ghz in out 50 w 4 2, 3, 5 6 1 50 w c 1 v cc c 3 c 5 c 6 c 4 l 1 c 2 output port matching circuit <3> f = 2.4 ghz in out 50 w l 1 l 2 4 2, 3, 5 6 1 50 w c 1 c 2 v cc c 4 c 5 c 3 output port matching circuit
data sheet p14895ej2v0ds00 7 m m m m pc8178tb illustration of the test circuit assembled on evaluation board <1> f = 1.0 ghz out in amp-4 top view c 5 c 4 c 1 c 2 c 3 l 1 c3b mounting direction connector connector component list 1.0 ghz output port matching c 1 , c 3 , c 5 1 000 pf c 2 0.75 pf c 4 10 pf l 1 12 nh
data sheet p14895ej2v0ds00 8 m m m m pc8178tb <2> f = 1.9 ghz out in amp-4 top view c 6 c 5 c 4 c 1 c 2 c 3 l 1 c3b mounting direction connector connector component list 1.9 ghz output port matching c 1 , c 3 , c 5 , c 6 1 000 pf c 2 0.5 pf c 4 10 pf l 1 3.9 nh
data sheet p14895ej2v0ds00 9 m m m m pc8178tb <3> f = 2.4 ghz out in amp-4 top view c 5 c 4 c 3 c 1 c 2 l 2 l 1 c3b mounting direction connector connector component list 2.4 ghz output port matching c 1 , c 2 , c 4 , c 5 1 000 pf c 3 10 pf l 1 1.8 nh l 2 2.7 nh notes ( * 1) 42 35 0.4 mm double sided copper clad polyimide board ( * 2) solder plated on pattern ( * 3) back side: gnd pattern ( * 4) : through holes
data sheet p14895ej2v0ds00 10 m m m m pc8178tb typical characteristics (unless otherwise specified, t a = +25 c) circuit current vs. supply voltage supply voltage v cc (v) circuit current i cc (ma) 2.5 01234 0.5 1 1.5 2 no signal v cc = 3.0 v 0 circuit current vs. operating ambient temperature operating ambient temperature t a ( c) circuit current i cc (ma) 2.5 ?0 ?0 ?0 0 +20 +40 +60 +80 +100 0.5 1 1.5 2 0 no signal
data sheet p14895ej2v0ds00 11 m m m m pc8178tb 1.0 ghz output port matching s-parameters (monitored at connector on board) t a = +25 c , v cc = v out = 3.0 v 1 s 11 1: 62.488 w ?8.969 w 2.699 pf 1 000.000 000 mhz stop 3 100.000 000 mhz start 100.000 000 mhz marker 1 1 ghz 1 s 22 1: 61.654 w ?1.893 w 13.383 pf 1 000.000 000 mhz stop 3 100.000 000 mhz start 00.000 000 mhz
data sheet p14895ej2v0ds00 12 m m m m pc8178tb 1.0 ghz output port matching power gain vs. frequency frequency f (ghz) power gain g p (db) +20 +10 0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 isolation vs. frequency frequency f (ghz) isolation isl (db) ?0 ?0 ?0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 isolation vs. frequency input return loss vs. frequency frequency f (ghz) input return loss rl in (db) 0 ? ?0 0.1 0.3 1.0 3.0 ?5 ?0 ?5 ?0 frequency f (ghz) input return loss vs. frequency frequency f (ghz) input return loss rl in (db) 0 ? ?0 0.1 0.3 1.0 3.0 ?5 ?0 ?5 ?0 isolation isl (db) ?0 ?0 ?0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 power gain vs. frequency frequency f (ghz) power gain g p (db) +20 +10 0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 v cc = 3.0 v v cc = 3.0 v v cc = 3.0 v t a = +25 c v cc = 3.3 v t a = ?0 c t a = +85 c v cc = 2.4 v v cc = 2.4 v v cc = 3.3 v v cc = 2.4 v v cc = 3.0 v t a = ?0 c t a = +85 c t a = +25 c v cc = 3.0 v v cc = 3.3 v t a = ?0 c t a = +25 c t a = +85 c
data sheet p14895ej2v0ds00 13 m m m m pc8178tb 1.0 ghz output port matching output return loss vs. frequency frequency f (ghz) output return loss rl out (db) +5 0 ? 0.1 0.3 1.0 3.0 ?0 ?5 ?0 ?5 output power vs. input power input power p in (dbm) output power p out (dbm) +10 +5 00 ? ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 +5 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 +5 ?0 ?5 ?0 ?5 ?0 +10 +5 ? ?0 ?5 ?0 ?5 ?0 output power vs. input power output power of each tone, im 3 vs. input power of each tone input power of each tone p in(each) (dbm) output power of each tone p o(each) (dbm) 3rd order intermodulation distortion im 3 (dbm) +20 +10 0 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 input power p in (dbm) 3rd order intermodulation distortion vs. output power of each tone output power of each tone p o(each) (dbm) 3rd order intermodulation distortion im 3 (dbc) ?0 ?0 ?0 ?5 ?0 ?5 ?0 ? 0 ?0 ?0 ?0 0 output power p out (dbm) output return loss vs. frequency frequency f (ghz) output return loss rl out (db) +5 0 ? 0.1 0.3 1.0 3.0 ?0 ?5 ?0 ?5 v cc = 3.0 v v cc = 3.0 v v cc = 3.0 v f 1 = 1 000 mhz f 2 = 1 001 mhz f 1 = 1 000 mhz f 2 = 1 001 mhz v cc = 3.0 v im 3 p o(each) v cc = 3.3 v v cc = 3.0 v v cc = 2.4 v v cc = 2.4 v v cc = 2.4 v v cc = 3.3 v t a = ?0 c t a = +25 c t a = +85 c v cc = 3.0 v v cc = 3.3 v t a = ?0 c t a = +85 c t a = +25 c
data sheet p14895ej2v0ds00 14 m m m m pc8178tb 1.0 ghz output port matching noise figure vs. supply voltage supply voltage v cc (v) noise figure nf (db) 7 6.5 6 2 2.5 3 3.5 5.5 5 4.5 4 t a = +85 c t a = +25 c t a = ?0 c
data sheet p14895ej2v0ds00 15 m m m m pc8178tb 1.9 ghz output port matching s-parameters (monitored at connector on board) t a = +25 c , v cc = v out = 3.0 v 1 s 11 1: 38.854 w ?5.852 w 1.8269 pf 1 900.000 000 mhz stop 3 100.000 000 mhz start 100.000 000 mhz marker 1 1.9 ghz 1 s 22 1: 37.332 w 0.8965 w 75.095 ph 1 900.000 000 mhz stop 3 100.000 000 mhz start 100.000 000 mhz
data sheet p14895ej2v0ds00 16 m m m m pc8178tb 1.9 ghz output port matching power gain vs. frequency frequency f (ghz) power gain g p (db) +20 +10 0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 isolation vs. frequency frequency f (ghz) isolation isl (db) ?0 ?0 ?0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 isolation vs. frequency input return loss vs. frequency frequency f (ghz) input return loss rl in (db) 0 ? ?0 0.1 0.3 1.0 3.0 ?5 ?0 ?5 ?0 frequency f (ghz) input return loss vs. frequency frequency f (ghz) input return loss rl in (db) 0 ? ?0 0.1 0.3 1.0 3.0 ?5 ?0 ?5 ?0 isolation isl (db) ?0 ?0 ?0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 power gain vs. frequency frequency f (ghz) power gain g p (db) +20 +10 0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 v cc = 3.3 v v cc = 3.0 v v cc = 3.0 v v cc = 3.0 v v cc = 3.0 v v cc = 2.4 v t a = ?0 c t a = +25 c t a = +85 c v cc = 3.0 v v cc = 3.3 v v cc = 2.4 v t a = +25 c t a = ?0 c t a = +85 c v cc = 3.3 v v cc = 3.0 v t a = +85 c t a = +25 c t a = ?0 c v cc = 2.4 v
data sheet p14895ej2v0ds00 17 m m m m pc8178tb 1.9 ghz output port matching output return loss vs. frequency frequency f (ghz) output return loss rl out (db) +5 0 ? 0.1 0.3 1.0 3.0 ?0 ?5 ?0 ?5 output power vs. input power input power p in (dbm) output power p out (dbm) +10 +5 00 ? ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 +5 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 +5 ?0 ?5 ?0 ?5 ?0 +10 +5 ? ?0 ?5 ?0 ?5 ?0 output power vs. input power output power of each tone, im 3 vs. input power of eachtone input power of each tone p in(each) (dbm) output power of each tone p o(each) (dbm) 3rd order intermodulation distortion im 3 (dbm) +20 +10 0 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 input power p in (dbm) 3rd order intermodulation distortion vs. output power of each tone output power of each tone p o(each) (dbm) 3rd order intermodulation distortion im 3 (dbc) ?0 ?0 ?0 ?5 ?0 ?5 ?0 ? 0 ?0 ?0 ?0 0 output power p out (dbm) output return loss vs. frequency frequency f (ghz) output return loss rl in (db) +5 0 ? 0.1 0.3 1.0 3.0 ?0 ?5 ?0 ?5 v cc = 3.0 v v cc = 3.0 v f 1 = 1 900 mhz f 2 = 1 901 mhz v cc = 3.0 v f 1 = 1 900 mhz f 2 = 1 901 mhz im 3 p o(each) v cc = 2.4 v v cc = 3.0 v v cc = 3.3 v t a = +85 c t a = +25 c t a = ?0 c v cc = 3.3 v v cc = 3.0 v v cc = 2.4 v t a = ?0 c t a = +85 c t a = +25 c v cc = 2.4 v v cc = 3.0 v v cc = 3.3 v
data sheet p14895ej2v0ds00 18 m m m m pc8178tb 1.9 ghz output port matching noise figure vs. supply voltage supply voltage v cc (v) noise figure nf (db) 6.5 6 5.5 2 2.5 3 3.5 5 4.5 4 t a = +85 c t a = +25 c t a = ?0 c
data sheet p14895ej2v0ds00 19 m m m m pc8178tb 2.4 ghz output port matching s-parameters (monitored at connector on board) t a = +25 c , v cc = v out = 3.0 v 1 s 11 1: 31.873 w ?3.441 w 1.983 pf 2 400.000 000 mhz stop 3 100.000 000 mhz start 100.000 000 mhz marker 1 2.4 ghz 1 s 22 1: 41.125 w 20.08 w 1.3316 nh 2 400.000 000 mhz stop 3 100.000 000 mhz start 100.000 000 mhz
data sheet p14895ej2v0ds00 20 m m m m pc8178tb 2.4 ghz output port matching power gain vs. frequency frequency f (ghz) power gain g p (db) +20 +10 0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 isolation vs. frequency frequency f (ghz) isolation isl (db) ?0 ?0 ?0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 isolation vs. frequency input return loss vs. frequency frequency f (ghz) input return loss rl in (db) 0 ? ?0 0.1 0.3 1.0 3.0 ?5 ?0 ?5 ?0 frequency f (ghz) input return loss vs. frequency frequency f (ghz) input return loss rl in (db) 0 ? ?0 0.1 0.3 1.0 3.0 ?5 ?0 ?5 ?0 isolation isl (db) ?0 ?0 ?0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 power gain vs. frequency frequency f (ghz) power gain g p (db) +20 +10 0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 v cc = 3.0 v v cc = 3.0 v v cc = 3.0 v v cc = 3.3 v v cc = 3.0 v v cc = 2.4 v t a = ?0 c t a = +25 c t a = +85 c v cc = 3.3 v v cc = 3.0 v v cc = 2.4 v t a = ?0 c t a = +25 c t a = +85 c v cc = 2.4 v v cc = 3.0 v v cc = 3.3 v t a = ?0 c t a = +25 c t a = +85 c
data sheet p14895ej2v0ds00 21 m m m m pc8178tb 2.4 ghz output port matching output return loss vs. frequency frequency f (ghz) output return loss rl out (db) +5 0 ? 0.1 0.3 1.0 3.0 ?0 ?5 ?0 ?5 output power vs. input power input power p in (dbm) output power p out (dbm) +10 +5 00 ? ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 +5 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 +5 ?0 ?5 ?0 ?5 ?0 +10 +5 ? ?0 ?5 ?0 ?5 ?0 output power vs. input power output power of each tone, im 3 vs. input power of each tone input power of each tone p in(each) (dbm) output power of each tone p o(each) (dbm) 3rd order intermodulation distortion im 3 (dbm) +10 0 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 input power p in (dbm) 3rd order intermodulation distortion vs. output power of each tone output powr of each tone p o(each) (dbm) 3rd order intermodulation distortion im 3 (dbc) ?0 ?0 ?0 ?5 ?0 ?5 ?0 ? 0 ?0 ?0 ?0 0 output power p out (dbm) output return loss vs. frequency frequency f (ghz) output return loss rl out (db) +5 0 ? 0.1 0.3 1.0 3.0 ?0 ?5 ?0 ?5 v cc = 3.0 v v cc = 3.0 v f 1 = 2 400 mhz f 2 = 2 401 mhz f 1 = 2 400 mhz f 2 = 2 401 mhz im 3 v cc = 2.4 v v cc = 3.0 v v cc = 3.3 v t a = ?0 c t a = +25 c t a = +85 c v cc = 2.4 v v cc = 3.0 v v cc = 3.3 v t a = ?0 c t a = +25 c t a = +85 c p o(each) v cc = 3.3 v v cc = 3.0 v v cc = 2.4 v
data sheet p14895ej2v0ds00 22 m m m m pc8178tb 2.4 ghz output port matching noise figure vs. supply voltage supply voltage v cc (v) noise figure nf (db) 2 2.5 3 3.5 t a = +85 c t a = ?0 c 6.5 6 5.5 5 4.5 4 t a = +25 c remark the graphs indicate nominal characteristics.
data sheet p14895ej2v0ds00 23 m m m m pc8178tb s-parameters (v cc = v out = 3.0 v) s 11 -frequency 3.0 g 2.0 g 1.0 g 0.1 g s 22 -frequency 3.0 g 2.0 g 1.0 g 0.1 g
data sheet p14895ej2v0ds00 24 m m m m pc8178tb typical s-parameter values (t a = +25 c) v cc = v out = 3.0 v, i cc = 1.9 ma frequency s 11 s 21 s 12 s 12 mhz mag.ang.mag.ang.mag.ang.mag.ang. 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 0.821 0.692 0.598 0.540 0.501 0.484 0.477 0.474 0.469 0.466 0.453 0.447 0.442 0.439 0.439 0.439 0.433 0.427 0.416 0.405 0.399 0.395 0.398 0.396 0.394 0.382 0.368 0.360 0.359 0.357 0.355 - 16.9 - 26.0 - 30.2 - 31.6 - 33.1 - 34.0 - 35.5 - 37.4 - 40.4 - 42.8 - 45.2 - 48.2 - 51.3 - 55.1 - 59.0 - 62.6 - 66.0 - 69.8 - 73.1 - 77.4 - 82.2 - 86.5 - 89.4 - 92.5 - 95.2 - 97.5 - 101.1 - 104.8 - 108.7 - 111.2 - 113.7 1.060 1.042 1.085 1.164 1.259 1.365 1.516 1.601 1.700 1.791 1.867 1.929 2.030 2.067 2.109 2.118 2.089 2.082 2.034 2.025 1.967 1.992 1.999 2.019 1.963 2.013 1.948 1.934 1.986 1.951 2.049 180.0 - 177.2 - 174.3 - 172.7 - 172.3 - 173.8 - 176.1 - 179.4 177.2 172.1 167.6 163.2 157.3 152.2 146.4 142.5 137.2 132.7 127.9 124.0 119.6 116.7 113.6 110.7 107.2 103.6 101.4 96.2 94.5 89.5 85.8 0.002 0.004 0.004 0.004 0.006 0.004 0.005 0.006 0.006 0.006 0.006 0.005 0.005 0.006 0.004 0.006 0.005 0.006 0.005 0.006 0.005 0.004 0.005 0.003 0.004 0.005 0.005 0.007 0.005 0.008 0.009 83.1 57.2 56.5 40.1 36.8 27.3 41.3 47.2 41.9 39.8 30.9 27.1 37.0 40.6 52.5 32.5 44.7 52.4 48.6 42.4 57.6 62.3 70.7 105.5 88.3 110.9 107.6 124.4 100.5 128.9 113.3 0.996 0.994 0.985 0.973 0.958 0.952 0.948 0.946 0.942 0.927 0.916 0.915 0.913 0.907 0.902 0.888 0.880 0.882 0.884 0.880 0.872 0.864 0.863 0.862 0.860 0.857 0.849 0.846 0.842 0.844 0.846 - 1.9 - 3.9 - 5.4 - 6.9 - 8.2 - 9.7 - 10.8 - 11.9 - 13.0 - 14.4 - 15.5 - 16.8 - 17.8 - 19.0 - 19.8 - 21.1 - 22.0 - 23.0 - 24.1 - 25.0 - 26.1 - 27.2 - 28.1 - 29.2 - 30.4 - 31.2 - 32.1 - 33.2 - 34.7 - 35.4 - 36.7
data sheet p14895ej2v0ds00 25 m m m m pc8178tb package dimensions 6-pin super minimold (unit: mm) 0.9 0.1 0.7 0 to 0.1 +0.1 ?.05 2.0 0.2 1.3 0.65 0.65 0.2 +0.1 ?.05 2.1 0.1 1.25 0.1 0.1 min. 0.15
data sheet p14895ej2v0ds00 26 m m m m pc8178tb notes on correct use (1) observe precautions for handling because of electro-static sensitive devices. (2) form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). all the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) the bypass capacitor should be attached to v cc line. (4) the inductor (l) should be attached between output and v cc pins. the l and series capacitor (c) values should be adjusted for applied frequency to match impedance to next stage. (5) the dc capacitor must be attached to input pin. recommended soldering conditions this product should be soldered under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nec sales representative. soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 235c or below time: 30 seconds or less (at 210c) count: 3, exposure limit: none note ir35-00-3 vps package peak temperature: 215c or below time: 40 seconds or less (at 200c) count: 3, exposure limit: none note vp15-00-3 wave soldering soldering bath temperature: 260c or below time: 10 seconds or less count: 1, exposure limit: none note ws60-00-1 partial heating pin temperature: 300c time: 3 seconds or less (per side of device) exposure limit: none note C note after opening the dry pack, keep it in a place below 25c and 65% rh for the allowable storage period. caution do not use different soldering methods together (except for partial heating). for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e) .
data sheet p14895ej2v0ds00 27 m m m m pc8178tb [memo]
m m m m pc8178tb attention observe precautions for handling electrostatic sensitive devices m8e 00. 4 the information in this document is current as of november, 2000. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above).

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